Senior Signal Integrity Engineer – LPU Packaging

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. We have built an incredible legacy of innovation fueled by great technology and amazing people. Today, we are tapping into the unlimited potential of AI to define the next era of computing. As an NVIDIAN, you will be immersed in a diverse, supportive environment where everyone is inspired to do their life’s work. Come join the team and see how you can make a lasting impact on the world.NVIDIA is now looking for a Senior Signal Integrity Engineer to join our Packaging and Systems team! In this role, you will drive high-speed SerDes channel design, simulation, and correlation for next-generation advanced packages and data center platforms. You will work across silicon, package, board, and system boundaries to develop robust high-speed interconnect solutions for demanding HPC and AI applications, where signal integrity is critical to performance, scale, and reliability!What you’ll be doingLead signal integrity design and analysis for high-speed SerDes channels across die, package, board, connector, socket, and cable interfacesDevelop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, with strong focus on channel loss, discontinuities, return path behavior, and crosstalkBuild and optimize chip-package-board co-simulation methodologies for next-generation HPC and data center systemsDrive SI modeling and design optimization for package escapes, vias, breakouts, interposers, substrates, sockets, and other critical channel structuresPerform pre-layout and post-layout signal integrity analysis, create design guidelines, and review layouts to ensure electrical performance targets are metCorrelate simulation with lab measurements using TDR, VNA, oscilloscope, and related measurement techniques to improve model accuracy and signoff confidenceWork closely with ASIC, package, board, mechanical, thermal, and validation teams to co-optimize electrical performance across the full product stackSupport interface bring-up, debug, and margin analysis, and help translate correlation learnings into improved design methods and reusable flowsAutomate analysis, data processing, and visualization to improve productivity and scale SI methodology across multiple programsWhat we need to seeBS, MS, or PhD in Electrical Engineering or equivalent experience8+ years of industry experience in signal integrity, high-speed interconnect design, or related hardware development rolesStrong background in electromagnetics, transmission line theory, channel modeling, and high-speed serial link behaviorProven experience with high-speed SerDes design and analysis for advanced packaging and/or large-scale system applicationsHands-on experience with industry-standard SI tools such as Ansys HFSS, SIwave, Cadence Sigrity, ADS, HSPICE, or equivalentExperience building and using channel models, S-parameters, IBIS-AMI based flows, and time/frequency-domain analysis techniquesStrong understanding of NRZ and PAM4 signaling, equalization techniques, jitter/noise mechanisms, and end-to-end channel budgetsExperience with simulation-to-measurement correlation and lab-based model validation using VNA, TDR, and high-speed scope measurementsAbility to work effectively across cross-functional teams and drive technical decisions in a fast-moving product environmentWays to stand out from the crowdExperience with package and system SI for PCIe, CXL, NVLink, Ethernet, or other high-speed compute and networking interfacesDeep knowledge of advanced packaging structures, substrate technologies, and chip-package-board co-designBackground in SI design for data center, AI infrastructure, or HPC platformsExperience improving SI signoff methodology, building reusable automation flows, or driving design rule developmentFamiliarity with mixed-domain tradeoffs across SI, PI, thermal, mechanical, and manufacturability considerationsWe have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our world-class engineering teams are growing fast. If you are creative, curious, and motivated with real passion for technology, we want to hear from you!#LI-HybridYour base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 264,500 USD for Level 4, and 196,000 USD - 310,500 USD for Level 5.You will also be eligible for equity and benefits.Applications for this job will be accepted at least until July 10, 2026.This posting is for an existing vacancy. NVIDIA uses AI tools in its recruiting processes.NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.