Welcome to the world of NVIDIA, where innovation knows no bounds. We've been at the forefront of technology for over two decades, and our groundbreaking invention of the GPU in 1999 revolutionized not only an industry but also the very way we engage with computers, robots, and autonomous vehicles. Today, NVIDIA stands as the epitome of AI computing, and our steadfast commitment to pushing the limits of what's achievable has propelled us to the forefront of innovation. Join us on this remarkable journey where we shape the future every day.You're about to join an exclusive team in our failure analysis lab. We specialize in IC defect localization, physical analysis, and all sample preparation techniques essential for both electrical and physical analysis. In your role, you'll play a key part in advancing Physical Failure Analysis (PFA) techniques, aiming to take FA capabilities to new heights.What you’ll be doing:1) Sample Preparation techniques development and implementation to facilitate electrical fault isolation and physical failure analysis, which include:Mechanical cross-sectioning, parallel de-layering, chemical and plasma etch de-processing of IC devices at die, package, component, and board levels. Board removal for re-balling and testing purposes.Die backside ultra-thinning for LVP/LVI, LADA/SDL, and PEM analyses, using a polishing wheel or through CNC milling.Development of sample preparation methods for circuit editing and E-beam probing.2) Failure Analysis Investigations:Conduct comprehensive physical failure analyses to uncover the root causes responsible for yield losses and reliability failures.Perform electrical analysis and material characterizations to assist engineering teams in evaluations or experiments for design optimization and process improvement for new product yield and reliability.What we need to see:Possess an in-depth understanding of semiconductor IC fabrication/assembly processes.Proficiency in IC device sample preparations for various failure analysis tasks, including defect localization and physical root cause analysis.Hands-on experience in Optical and Scanning Electron microscopy.Familiarity with 2D/3D X-Ray, Curve-tracing, Thermal/Photo Emission Microscopy, CAD layout, and relevant analysis methods.Strong written and verbal communication skills.Minimum of 5 years of industrial experience in IC failure analysis.B.S. degree in Science or Engineering or equivalent experience.NVIDIA is widely considered to be one of the technology world’s most desirable employers. This position is very meaningful to NVIDIA Corporation worldwide and helps keep the company ranked at a high level for corporate and social responsibility. As an NVIDIAN, you will be immersed in an encouraging environment where everyone is inspired to do their best work. If you're creative and autonomous, we want to hear from you!The base salary range is $104,000 - $166,750. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.You will also be eligible for equity and benefits.NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
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