Senior Process Development Engineer - Electro-Optical Packaging

NVIDIA has continuously reinvented itself over three decades. Our invention of the GPU in 1999 fueled the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are difficult to address, that only we can seek, and that makes a difference to the world. Join us in revolutionizing the world of AI!We are now looking for Process Development Engineer in the Electro-Optical Packaging team to support developing new NVIDIA's products. This newest member will collaborate with an innovative multidisciplinary world-class team of engineers to help develop and build our industry leading transceivers. In this role you will responsible for multiple sophisticated assembly (packaging) platforms, so there will be plenty of opportunity for learning new skills related to the field of advanced packaging. The primary responsibility is to develop the optical packaging processes to ensure outstanding quality GPU server products may be released to the market and delight our customers so that AI scientists and datacenter operators can achieve their professional aspirations using NVIDIA technology. The new engineering team member will co-operate with the rest of team to develop product assembly flow according to priorities, demonstrate a passion towards system level product quality, and should be comfortable in the lab environment.What you’ll be doing:Work with suppliers to customize and build process machines.Evaluate and qualify new bonding materials.Using new equipment, develop new assembly methods.Lead process failure tasks.Create Process Transfer package for production team.Train and support manufacturing team during bring up.What we need to see:B.Sc. in Materials Science +5 years experience in process team or Materials department.Demonstrated knowledge in packaging processes of semiconductor industry.Traveling abroad with frequency of one week in a quarter.Good attention to detail, as well as clear written and verbal communications.Ways to stand out from the crowd:Previous experience in R&D teamProven experience and deep knowledge in precise assembly machines - Ficonetech, Bessi, Amicra, etc...M.Sc. in Materials Science + 5 years experience or Ph.D. with research in field of interest.Demonstrated knowledge in bonding materials - adhesives, solders, pastes.