Signal and Power Integrity Engineer

We are now looking for a Signal & Power Integrity Engineer. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence.What you'll be doing:Drive board/system level signal and power integrity requirementsLead board/system SI/PI design activities, including PCB stackup/material selection, design guide implementation, layout review, and post-layout analysisWork closely with Architecture, ASIC, Mixed Signal, Package, and PCB Design teams to design and ensure system SI/PI performance meets expectation before Gerber out, also work closely with Design Validation teams to support SI/PI failure analysisDevelop novel algorithms & new methodologies to improve SI/PI modeling effortsWork with Application Engineering teams to support customers w/ SI/PI questionsVNA & TDR measurements to support model correlation efforts and improve confidence in design stageWhat we need to see:MS/BS in EE or equivalent experienceMinimum 3 years of experience as a SI/PI engineerDeep understanding of electromagnetics, specifically electromagnetic waves including transmission line theory and via propertiesProficient with HFSS, Sigrity, Hspice, and/or other simulation toolsExperienced with Cadence Allegro PCB designer and Constraints ManagerUnderstanding of high volume manufacturing variations and impact to channel signal integrityExposure to lab measurements including VNA & TDR experiencePassionate about SI/PI workGood written & verbal interpersonal skills in EnglishWays to stand out from the crowd:Familiarity with NRZ/PAM-4/Duo-binary signaling schemesExposure to interface timing budgets and system modelingFamiliarity with high-speed I/O design concepts including clock generation, transmitter & receiver design, and equalization schemesPDN analyses including model generation and time domain simulationExperience w/ Matlab, Python, and C as well as exposure to package design