NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to seek, that only we can pursue, and that matter to the world. This is our life’s work, to amplify human creativity and intelligence. Make the choice to join us today.What you’ll be doing:The focus will be primarily on flip chip packages, multi-chip modules, and heterogeneous integration of chip package design.Set up the design, generate netlist/symbol, build routing strategy, and implement package routing to meet the rules required for very high-speed Serdes, very high-power consumption, and large pin-count devices.Collaborate with SI and PI engineers to optimize the layout design and enable industry-leading integration.Collaborate in multi-functional discussions for package architecture and technology roadmap and partner with PKG SI/PI and Silicon physical design teams to optimize chip Floorplan and bump placement.Identify and drive cost-saving opportunities and/or performance-enhancing features.Contribute to team design reviews with useful feedback to improve the quality, capability, and experience of teammates.Define and develop design verification and automation strategies to strengthen and streamline package design and release flows.Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development.What we need to see:Bachelor's degree in Electrical Engineering or related field, or equivalent experience5 or more years in the industry with packaging or PCB design development. Experience with pin count, high power, and high-speed packages or equivalent PCBs.A working knowledge of Cadence Allegro Packaging Design (APD) and PCB Editor, familiar with Valor or Caliber is a plus.Good organic substrate design experienceFamiliar with package assembly and Substrate manufacturing processKnowledge of high-speed layout constraints (crosstalk, differential pairs, EMI, PCB/package resonance, power integrity).Hands-on knowledge of Design Rules Check and Design for Manufacturing.Good understanding of system specification and IC design, ability to work with design teams to translate IC/system requirements into package / SIP configuration.Ways to stand out of the crowd:Solid fundamentals in electrical/material/thermal/mechanical engineering field.SI/PI tools ( PowerSI, HFSS, etc.), package model extraction, S-parameters, and RLGC model.A complete knowledge of packaging materials and material properties, knowledge of Flip chip, MCM, 2.5D, and other advanced packaging options will be helpful.Understanding of power integrity considerations and multi-gigabit design challenges.Strong communication skills and good teamwork skills in working together to achieve goals with a can-do attitude with great passion.NVIDIA is widely considered to be one of the technology world’s most desirable employers. We have some of the most forward-thinking and hardworking people in the world working for us. If you're creative and autonomous, we want to hear from you!
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