Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Position SummaryBroadcom in Ft. Collins, CO seeks an engineer for integrated circuit (IC) design tool development and reticle creation support. In addition to building tools to enable new process technologies, this engineer will develop/revise tools to reduce reticle creation time, prevent/detect errors, and maximize productivity.Job DescriptionThe primary objective for this position is to facilitate the efficient creation of engineering, development, and production reticle sets for Broadcom’s FBAR technology products. Key challenges include complicated design rules, a large number of reticle sets, and the demand for flawless & rapid execution. Created design kits must be robust, easy-to-use, meet lithography requirements, enable process diagnostics, and require minimal wafer area. For process technology development, creating correct reticles requires a strong understanding of the device integration and fabrication steps. Specific Objectives and ResponsibilitiesMaster existing reticle creation processes and design tools to enable effective supportDevelop a solid understanding of FBAR design & process flows, layers, integration, and design & fabrication challengesStrictly adhere to established procedures and standards to create error-free reticles and a complete development recordIdentify improvement opportunities and develop tools/procedures to increase productivity and/or reduce quality risks in reticle set creationIn conjunction with lithography and metrology engineering, insure reticle methodology meets all fabrication requirementsWork with R&D and integration engineers to create experiment reticles and design kits to meet new technology development requirementsSkills/ExperienceBS in engineering or physical science, with a strong knowledge of electrical engineering concepts and 5+ years related experience or MS in engineering or physical science, with a strong knowledge of electrical engineering concepts and 3+ years related experienceUnderstanding of integrated circuit and/or thin-film fabrication techniquesProficient with IC design tools (preferably Cadence), Python, SKILL programming, Unix, scripting language(s), and Microsoft Windows & Office applicationsDemonstrated rigorous adherence to best practices in software design, coding, testing and documentationStrong teamwork skills fostering productive interactions with reticle designers & layout techs, device designers, and process engineersStrong written & verbal communication skillsAdditional Skills/QualificationsIC design experience and/or advanced degree preferredDemonstrated initiative & leadership in a team environmentAdditional Job Description:Compensation and BenefitsThe annual base salary range for this position is $78,000 - $130,000.This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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