ASIC Design Engineer

ASIC Design EngineerDescription -HP is the world’s leading printing company. We are looking for innovators who are ready to make a purposeful impact. You will be a member of the R&D digital Application-Specific Integrated Circuit (ASIC) design team that develops the main controller with critical HP proprietary intellectual property that separates HP printers from the rest of the competitions. You will work with internal and external partners to deliver industry-leading embedded solutions for future HP printers. Responsibilities: Own functional blocks and/or subsystems of digital ASICs from design to silicon verification. This includes RTL coding, verification, silicon validation, and qualification.Work with team members and partners to align on specifications, conduct reviews, and complete documentation.Triage product hardware & firmware integration issues to deliver robust solutions.Participate in ASIC prototype in FPGA for pre-silicon HW system validation and early firmware development.Participate in design methodology and tool automation work as needed.Contribute to ASIC roadmaps and future innovation.Develop technical leadership skills.Education and Experience Required: Bachelor's or Master's degree in electrical engineering or equivalent with focus on SOC design.3 - 5 years of ASIC or SOC design experience.Knowledge and Skills: Knowledge of submicron semiconductor technology.Knowledge of embedded system design, verification, and product development lifecycle.Familiar with digital ASIC/SOC design flow from RTL to silicon characterization.Familiar with Synopsys and Cadence EDA tools for Simulation, Synthesis, Timing (STA), Formal and Assertion based verification, etc.Familiar with design and programming languages: Verilog, System Verilog, Python, Perl, C, C++, etc.Familiar with code base management method including subversion, git, GitHub, etc.Ability to apply analytical and problem-solving skills.Strong written and verbal communication skills, ability to negotiate design features and options.Working knowledge of electronic components, PCA designs and use of test equipment.      Domain know-hows in one or more areas below is a plus.ARM microprocessor subsystem.Ethernet HW and industry standard High-Speed IO IPs for embedded system.Memory and storage subsystem (DDR, Flash, eMMC, etc.)Xilinx FPGA design methodology.HP offers a comprehensive benefits package, including:•  Dental insurance•  Disability insurance•  Employee assistance program•  Flexible schedule•  Flexible spending account•  Health insurance•  Life insurancePer the Washington statute, the estimated range of compensation for this job in Vancouver, at the time of this posting, is $108,000 to $132,000.  This position may be eligible for incentive pay, for openings where this is applicable.#LI-POSTJob -EngineeringSchedule -Full timeShift -No shift premium (United States of America)Travel -NoRelocation -YesEEO Tagline - HP Inc. is EEO F/M/Protected Veteran/ Individual with Disabilities.