Process Engineer

Process EngineerDescription -MEMS Process Engineer - Wafer Fab Process EngineerAbout HP: HP Inc. is one of the leaders in Inkjet Technology. We work to maintain this position while adding new technologies and innovative products to our portfolio. We invent, develop and bring to market new technologies and capabilities as well as integrate these technologies into our systems. Our focus is on printing and imaging technologies as well as pursuing broader alternative technologies and research with an eye toward commercial applications. We are dedicated to providing advanced innovative solutions to our partners and customers. We develop technology for printers that fit in your packet or fill a semi truck, printing pocket sized memories to billboard signs.We are defining the future of printing in 2D and 3D Candidates who identify with a group that is historically underrepresented in the technology sector including by not limited to , African American, Latino, Native American, individuals with disabilities and Veterans are encouraged to apply. HP is an equal opportunity employer: Https://tbcdn.talentbrew.com/company/3544/v1_0/PDFs/HP%20Inc%20EEO%20Policy%20Statement%202017_Final_signed.pdf Job DescriptionThe MEMS section from the Print Microfluidics, Technology & Operations in Corvallis, Oregon is looking for an entry-level process engineer to work in our world-class MEMS Fab. HP Inc. is the leader in Inkjet Technology. We work to maintain this position while adding new technologies and innovative products to our portfolio. We invent, develop, and bring to market new technologies and capabilities as well as integrate these technologies into systems. Our focus is on printing and imaging technologies as well as pursuing broader alternative microfluidics technologies and research with an eye toward commercial applications. We provide advanced innovative solutions to our partners and customers. HP has a world-class MEMS fabrication facility.  Our fab uses a variety of novel processes to create fluidic features for thermal inkjet devices. The emphasis of this position will be on developing, characterizing, and stabilizing MEMS fabrication processes used for the production of inkjet components in the area of thin-film deposition, thin-film etch, photolithography or packaging.This person will support processes for released products as well as develop new processes for new products.  Key metrics will be capability, quality, and cost.Responsibilities: Develop fundamental understanding of fabrication processes and product development methodologies.Be the engineering owner for a toolset and lead the technical team to maintain and improve quality and cost.Develop new methods and capabilities in the workcenter, in support of product development needs, quality improvements, and cost optimizations.Collaborate with teams of engineers and technicians to complete assigned projectsDocument and present project methods and results.Qualifications: Bachelor’s degree in Chemical Engineering, Chemistry, Material Science, or related discipline, with a focus on silicon or MEMS processing and 0-2 years experience.Ability to work and interact effectively with team members from other disciplines, cultures, organizations, and other companies both locally and remotely.Understanding of the fundamental physical and chemical mechanisms of wafer or MEMS processing.Strong written and spoken communication skills.Demonstrated leadership, teamwork/interpersonal, communication and technical skills.Ability to creatively solve problems in a fast-paced product development environmentDesired: Experience in thin-film deposition, etch or photolithography.Experience with JMP or other data analysis or statistical softwareDemonstrated project management skills.#LI-POSTJob -EngineeringSchedule -Full timeShift -No shift premium (United States of America)Travel -Relocation -EEO Tagline - HP Inc. is EEO F/M/Protected Veteran/ Individual with Disabilities.