IC Test Engineer

IC Test EngineerDescription -Summary of Role:We have a position for R&D IC Test Engineer working at both wafer and packaged die level.  Primary duties will include development, characterization and validation of IC test program of semiconductor technologies and devices, as well as maintaining and improving data system scripts.  Our semiconductor technologies are used in wide range of inkjet printing solutions eg consumer, commercial, industrial, life science and others. Responsibilities:Work with various functional teams eg circuit design, product engineering and vendor to design and develop test program on ATE (Automated Test Equipment) eg Teradyne, SPEA Support and improve data transfer system includes building data configuration filesEnsure test solution robustness for sustainable production testingVolume data analysis using statistical data analysis toolsNew test hardware & software set-up, correlate and release to productionDefine test hardware (wafer and packaged die) specification according to selected ATE system to ensure full test coverageVerification of vectors for testing at wafer levelYield improvement and test time reduction activities to improve testing qualityFollow industry trend and understand new product requirements to define IC test technology roadmap Education and Work Experience:Bachelor's or Master's degree in Electrical/Electronics Engineering1 - 3 years experience in IC Test EngineeringTest program development & debug for digital / analog devicesProficiency in programming/scripting in C++, Python, Perl, C#Experience with product engineering activities eg yield improvement and test time reductionStatistical data analysis tools such as JMP or similarKnowledgeable in semiconductor fabrication, device testing and packagingAbility to work independently as well as in a team environmentJob -EngineeringSchedule -Full timeShift -No shift premium (United States of America)Travel -25%Relocation -YesEEO Tagline - HP Inc. is EEO F/M/Protected Veteran/ Individual with Disabilities.