Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Requirements: PhD in STEM or MS in STEm + 3 years of experience or BS in STEM and 5 years of experienceWork with business unit marketing and IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new advanced silicon node products (7nm, 5nm, 3nm and beyond)· Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages· Ensure designed packages meet CPI, SI/PI, and stringent thermal requirements (1000W+) of advanced node cutting edge silicon products· Research, develop, and productize new materials such as TIM, build-up-film, underfill etc. in support advanced node silicon (7nm & 5nm) POR definition· Manage IC packaging activity from concept through development, qualification and high volume production.· Be a specialist and able to define assembly BOM, process, troubleshoot, support on packaging issues on new advanced technology· Implement, fine-tune, and productize newly developed technologies into HVM· Create package design documentation and assembly instructions· Work close with QA and customers to resolve quality issues· Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp· Interface with other operations functional groups such as product engineering, foundry, test, and QA· Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new TIM material development etc.)· Interface with tier #1 external customers for custom ASIC programs or as needed for development support, quality and/or other issue resolution· Support NPI bring-up, pkg qual, and sustain support in production + multi-source activities for capacity, cost, & manufacturing flexibility needsAdditional Job Description: Compensation and Benefits
The annual base salary range for this position is $78,000.00 - $152,000.00.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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