Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Job Description : ( IC Design Engineer4)Block Level and Full chip level Static(IR)/Dynamic(IVD) sign-offSignal/Power EM sign-off at Block level and Full chipCustom power grid implementation for block/hardmacsSystem level Analysis (PDN) with board, package, interposer and dieWork with SoC and packaging team in bump assignment, pkg routing optimizationDynamic analysis with vectorless/vectors/mixed mode analysisPG Grid resistance checksKnowledge of physical implementation is a plusSkill Set :Hands-ons experience in RedHawk/RHSC/Voltus/PDN analysis/3DICGood understanding on Power Integrity Signoff ChecksKnowledge of Perl, TCL, PythonFamiliarity with Innovus/ICCAbility to communicate effectively with global cross functional teamsEducationMinimum QualificationsBachelors – CS/EE/ECWork ExperiencesMinimum years of experience : 1 to 9 YrsBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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