Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:TASKNew Product Introduction and development of RFIC circuits (CMOS, SOI, PA) for 5G smartphone Front End ModulesUnderstanding of design specification and procedure for new product, communicate with different team members to identify risks of new technologiesDesign test procedures and summarizing test result, define and carry-out experiments, come up with novel test solutions for production enablement and/or experimentationCoordinate to identify problems and solutions with other teams(troubleshoot, analyze, program, debug and test)Identify patterns of risk and communicate clearly with the rest of the team.SKILLSRF/Analog/digital circuit knowledgeExperience with circuit simulation, design and verification (Cadence (spectre, virtuoso), HFSS, ADS, etc)Experience with lab debug equipment, such as oscilloscopes, logic analyzers and RF equipmentsPrograming and data analysis skill with any of C#, C++, LabVIEW(TestStand), JMP JSL, MatLab, R, PythonSemiconductor process knowledge: Device technology, wafer fabrication, wafer-level measurements, process simulation, FAElectronics related industry experience (Bachelor + 3years, Master+ α experience , Ph.D), Master and above degree is preferred. Experience with out-sourcing testing house is prefered Fluent English communicationBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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