Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Broadcom's ASIC Product Division is seeking candidates for a DFT position at Shanghai. The successful candidate will be responsible for leading DFT programs all the way from chip level DFT specification, through to implementation and verification culminating in successfully releasing products to production.The candidate would be required to work on various phases of SoC DFT related activities for Broadcom APD (ASIC Products Division)’s designs – DFT Architecture, Test insertion and verification, Pattern generation, Coverage improvement, Post silicon debug and yield improvement to meet the product test metrics. It involves working with the Physical Design & STA team for DFT mode timing closure. The role could also involve direct interaction with external customers.It is expected that you can code using TCL, PERL, RUBY, PYTHON, C++ or similar.Responsibilities: Understanding Broadcom & customer DFT feature requirements & DPPM goals & defining appropriate DFT specifications for the ASICImplementing DFT, including Scan, MBIST, TAP, LBIST, IO, SerDes and other I/P DFT integrationWorking closely with STA and DI Engineers design closure for testGenerating, Verifying & Debugging Test vectors before tape release.Validating & Debugging Test vectors on ATE during the silicon bring up phaseAssisting with silicon failure analysis, diagnostics & yield improvement effortsInterfacing with the customer, physical design and test engineering/manufacturing teams located globallyWorking closely with I/P DFT engineers & other stakeholdersDebugging customer returned parts on the ATEInnovating newer DFT solutions to solve testability problems in 7nm & beyondAutomating DFT & Test Vector Generation flowsSkills/Experience: Strong DFT background (such as IO and Analog DFT, ATPG and/or Scan, BIST, and others)Scan Insertion and scan compression background (DFT Compiler, Mentor TestKompress, etc.)Well-versed in ATPG vector generation, simulation, and debugging. (TetraMax, Fastscan)Experience in Verilog coding, testbench generation & simulationMemory BIST insertion and verification experience on embedded (SRAM, CAM, eDRAM, ROM)Boundary scan Verification and test vector generation. Should have good knowledge in IEEE1149.1 and IEEE1149.6Basic knowledge Test-STA and constraintsStrong background on IEE1687, IJTAG, ICL and PDL The ability to work in a multi-disciplined, cross-department environmentSolid knowledge in analog and digital circuit design, and device physics fundamentalsGood understanding of Si processing, logical and physical synthesis, and transistor reliability principlesExcellent problem solving, debug , root cause analysis and communication skillsExperience working on the ATE is a plusExperience with Serdes, DDR, PCIE, ENET, CXL IOBIST verification and silicon debug is a plusExperience working on Tessent SSN is a plusEducation & Experience: Bachelors in Electrical/Electronic/Computer Engineering and 10+ years of relevant industry experience or Masters Degree in Electrical/Electronic/Computer Engineering and 8+ years of relevant industry experienceBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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