Packaging Engineer

Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Responsible for working with Broadcom's packaging/assembly subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, reliability and delivery of high volume semiconductor devices.Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC packaging.Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturityResponsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirementsDrive capability enhancement and cost reduction projectsJob RequirementsBachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical).10 years’ experience in semiconductor processes or packaging technologiesTrack record of good achievements in the following:1) Bringing new packaging technology into volume production2) Experience with advanced node silicon bumping, large body single & multi-chip package assembly (2.5D, 3D)3) Experience relating to chip-package-interaction, done work on how silicon material and processing factors impact the downstream margins of assembly processingHands on process and operational experience in manufacturing environmentExperience in component quality interactions with SMT processing is not a pre-requisite, but will be viewed favorablyProven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing and customers.Experience with managing activities with packaging subcontractors and driving resolution of manufacturing issues. Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.Good knowledge of problem solving methodologies and failure analysis techniques.Demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations. Demonstrate good communication skills in problem resolution.Have a very good command on spoken and written EnglishMust be fluent in MandarinWilling to travel throughout Asia to support manufacturing locations.Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.