Packaging Design Engineer

Packaging Design EngineerDescription -Interested candidates must be currently eligible to work in the US AND must not require work authorization sponsorship in the future. HP occasionally offers work authorization sponsorship for critical need roles. However, this opportunity currently does not offer work authorization sponsorship” and HP will not provide any assistance or sign documentation in support of immigration sponsorship including Optional Practical Training (OPT).  HP’s Supply Chain Organization is at the heart of the world’s most sustainable and just technology companies.We have an exciting Electronics Structural Packaging Opportunity, In this position you will design packaging for notebooks, desktops, printers, and displays.  The perfect candidate will have experience in designing Molded Pulp fiber cushions.As a Supply Chain employee, you will have the opportunity to gain hands-on experience in various aspects of the supply chain, while applying the Supply Chain Operations Reference (SCOR) model to optimize our processes.Strong analytical and problem-solving skills, with the ability to apply the SCOR model to identify process gaps and propose solutionsProficient in Microsoft Excel, PowerPoint and Teams and SharePointExcellent communication and interpersonal skills, with the ability to collaborate effectively with cross- functional teamsDetail-oriented and organized, with the ability to manage multiple tasks and meet deadlinesAbility to work successfully in an environment with varying levels of complexityA minimum cumulative GPA of 3.0 on a 4.0 scaleResponsibilities: Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with provided specifications and requirements.Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.Develops understanding of and relationship with internal and outsourced development partners on mechanical and thermal design and development.Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately- complex products.Education and Experience Required: Bachelor's or Master's degree in Packaging EngineeringTypically 0-2 years experienceKnowledge and Skills: Experience or understanding of ProEngineer or other 3D CAD software as a mechanical design tool.Good analytical and problem solving skills.Understanding of design for sheet metal and plastic parts and associated production tooling and processes.Understanding of thermal properties of materials and heat transfer.Good written and verbal communication skills; mastery in English and local language.HP offers a comprehensive benefits package, including:•  Dental insurance•  Disability insurance•  Employee assistance program•  Flexible schedule•  Flexible spending account•  Health insurance•  Life insurance  Per the Washington statute, the estimated range of compensation for this job in that location, at the time of this posting, is 52,000.00 - 72,000.00 USD Annual.  This position may be eligible for incentive pay, for openings where this is applicable.#LI-POSTJob -EngineeringSchedule -Full timeShift -No shift premium (United States of America)Travel -Relocation -EEO Tagline - HP Inc. is EEO F/M/Protected Veteran/ Individual with Disabilities.