R&D Engineer

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If you already have a Candidate Account, please Sign-In before you apply.Job Description:R&D Staff EngineerThe ideal candidate will have expertise in integrated-circuit process technologies, and semiconductor assembly including manufacturability and reliability issues with wide-ranging experience in semiconductor device fabrication and operation, device modeling and circuit design, test development and execution, device-level reliability failure mechanisms and testing, assembly process development and qualification, design kit development and wafer foundry manufacturing operations.  Serves as an internal investigator for new technology projects and is capable of independent project management from concept phase through transfer to high-volume manufacturing, facilitating clear communication with external foundry & assembly collaborators as well as internal design and validation teams throughout the project.  Can perform risk assessment and help to coordinate cross-functional technology risk mitigation for multiple projects in parallel.  Typically possesses a graduate degree in electrical engineering and has several years of experience in the field. Key QualificationsBroad knowledge of advanced silicon and packaging process technologiesWorking knowledge of the Advanced Semiconductor Technology nodes including FinFET and Gate All Around technology; Design experience is a plusWorking knowledge of 2.5D packaging technology and 3D stacked ICKnowledge and use of various EDA offerings from major EDA suppliers in semiconductor industry for IP and chip designWorking knowledge of IP and chip design flow for analog and digitalExperience with parametric and yield data analysis.  Proficiency with statistical data analysis toolsExperience with usage of device model usage, layout and circuit simulation tools, Parasitic extraction and simulation, abstract and LEF/DEF generation, LVS/ERC checks, physical verificationConducting design reviews & creating slides and other associated documentationAssisting with integration of IP into SOCs and creating guidelinesExperience with yield failure mechanisms and tools for root cause finding (EFA, PFA); Familiarity with device reliability degradation mechanisms, test methods, and lifetime modelingExceptional data analysis, problem solving, and interpersonal skillsBeing able to work with large teams from manufacturing, technology and packagingJob DescriptionProvide design support for IP & ASIC to create robust designs in line with advanced semiconductor and packaging process flows & constraintsWork closely with technology experts and Silicon manufacturing teams to deploy the technology requirements for ASIC product design & design automation flowsDefine process flows, design rules and IP adaptation guidelines for the advanced semiconductor technology and advanced packaging technologyDefine technology test vehicles for advanced technology & packaging for validation before product manufacturingProvide design rule reviews for IP, chip, and package designs for product release sign offProvide support for timing, physical verification signoff to make IP & ASIC designs robustPerform WAT & yield analysis on testchips and products to evaluate IP margins & robustnessWork with IP design teams to support adaptation of existing IP into various semiconductor packaging environmentsAssist with technology road mapping activity for selection of appropriate semiconductor and packaging technology for ASICs to meet end customer requirementsEducation & ExperienceBachelor’s degree in electrical engineering and 8+ years (OR) Master’s degree and 6+ years (OR) PhD and 3+ years of experience in semiconductor process technology and manufacturing, specifically R&D and integration rolesAdditional Job Description:Compensation and BenefitsThe annual base salary range for this position is $91,200 - $178,000.This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.